While the physical design of a chassis becomes standardized, the power dissipation inside of that chassis is anything but standardized, which can put a strain on the enclosure’s cooling capacity. Engineers have to ask several questions, such as what cooling technology can they use for higher power demands? Should it be liquid or air cooling? What are the true limits of air cooling given new approaches and when does liquid cooling become the only option? In this webinar, presented by thermal management expert Dr. Kaveh Azar, we explore the limits of air cooling and the role that liquid cooling will play in meeting the growing power and thermal demands of electronics systems.