ATS Webinar Series 2020 - Heat Pipes & Vapor Chambers - How They Work and Their Deployment in Electronics Thermal Management
As electronics become faster and more powerful, thermal solutions must evolve to deal with the increasing heat loads. Simply increasing the size of a heat sink, or adding a fan, was once enough to provide the required increased performance. But, while air cooling remains the dominant method of thermal management in the electronics industry, there are applications where traditional air cooling is not sufficient. This section discusses how to deploy heat pipes and vapor chambers in thermal management, including the use of micro-channels.
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Webinar sponsored by Future Facilities 6SigmaET, "Intelligent Thermal Simulation for Electronics" 6sigmaet.info/